Wafer edge roll-off application
Wafer edge roll-off measurement, analysis and characterization
- WaferSight OASys™ workstation
With the edge-rolloff application installed, use the WaferSight
OASys or NanoMapper OASys to
monitor and characterize the Roll-off of your wafer polishing and
chemical mechanical planarization process(es). Edge roll-off has
been found to impact film edge uniformity and wafer die yield, and
monitoring edge roll off can increase wafer die yield. Analyzing
measurements obtained by their respective metrology systems, the
OASys offline analysis software has robust edge rolloff measurement
capabilities.
Product Highlights:
