CMP Wafer Geometry

Post Chemical Mechanical Planarization flatness, shape and wafer thickness

Compatible with the demands of chemical mechanical planarization (CMP) process monitoring, WaferSight CMP flatness measurement of wafer surface quality on 300 millimeter semiconductor wafers, and on advanced 200 millimeter wafers. The measurement data, which provides pass/fail criteria for CMP wafer flatness, shape, thickness and bow, are compatible with SEMI standards for design rules down to the 45 nanometer node, which reduces cost of ownership calculations significantly.

AFS measures CMP process results on 300mm double side polished wafers down for 130nm design rules and up. The system has been certified to be compatible with CMP process control and quality control needs.

UltraGage and UltraScan measure wafer geometry after CMP for their respective technology nodes and wafer sizes (200mm and down).

Interconnect CMP

Dishing, erosion, planarity, and topography of CMP

HRP-350 is a 3D surface profiling system that can characterize the three-dimensional effects of Chemical Mechanical Planarization (CMP) on interconnect layers of semiconductor devices.

HRP-350 provides high resolution metrology of fine CMP features such as dishing and erosion, planarity and topography.

For 200mm wafer applications, stylus profiling is available using the wafer-handling HRP-250 stylus profiler.