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Film thickness measurement surface characterization plot of a quarter in 3-D
  • Film surface, minus substrate surface produces film thickness

 

Film thickness characteristics:

Surface measurements of films, such as stent films can be compared to surface measurements of the underlying substrate. If the substrate surface shape is subtracted from the height of the film surface, then the resulting data is equal to the thickness of the film, without the "noise" of the local fluctuations in the two surfaces.

Optical profiling using interference microscopy produces a high-precision three dimensional measurement of the surface character of many materials. Vertical precision may be as precise as fractions of a nanometer (i.e., in angstroms). Using a wavelength of light as the standard or measurement, surface peaks, valleys and slopes are accurately and repeatably measured using NIST-traceable processes - and without contacting surfaces.

The resulting plot contains reliable two dimensional cross-sections in any direction across the surface, and can be used to produce precise calculations of volume, including voids, wear, pits, grooves and failure marks, as well as solid displacement, relative flatness, average (relative) height variations, frequency and placement of peaks, size and shape of plateaus, tendency of a texture to depart from a mean (standard deviation), the presence and shape of surface flaws, the accuracy or precision of manufacturing, and so forth.

Surface characterization with a 3D optical profiler has been beneficially used in determining and maintaining quality control in film thickness of stents and other biomedical devices , because of the non-contact nature of the test. For example, in film coating processes, successive measurements can be made of the exact same location, to determine the cumulative effect or effectiveness of the coating process. Researchers and scientists have discovered the value of these recursive measurements in determining the efficacy of machining, coating, etching and chemical planarizing processes, as well as optimizing polish, cutting or time and materials.

In contrast, a stylus may alter the structure of a soft or brittle surface by rounding peaks. This can prohibit repeat measurement of a specific location, as the subsequent measurement would measure an altered surface structure. 

Products for this application

 

MicroXam

MicroXam RTS

RollXam

 

Related applications

Etch depth analysis

Material failure analysis

Surface measurement 2D profiles

Volumetric analysis

3D profiling of surfaces

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