Choose two or more areas of a plot to compare relative step heights
using the mature surface analysis software provided with MicroXAM.
Areas compared can be any rectangle from pinpoint to plateau, and the
areas' heights are averaged for comparison. Further useful analysis
features, such as auto-leveling, assist in adjusting the slopes of the
plateaus or areas as being relative to one another.
Step heights measured are extremely precise, expressed as fractions
of a nanometer to fractions of a micron. Step height precision is NIST-
traceable.
Optical profiling using interference microscopy produces a high-precision
three dimensional measurement
of the surface character of many materials. Vertical precision may
be as precise as fractions of a nanometer (i.e., in angstroms). Using
a wavelength of light as the standard or measurement, surface peaks,
valleys and slopes are accurately and repeatably measured using NIST-traceable
processes - and without contacting surfaces. 
- 3D model of ion probe hole in silicon
The resulting plot contains reliable two
dimensional cross-sections in any direction across the surface,
and can be used to produce precise calculations of volume,
including voids, wear, pits, grooves
and failure marks, as well as solid
displacement, relative flatness, average (relative) height variations,
frequency and placement of peaks, size and shape of plateaus, tendency
of a texture to depart from a mean, the presence and shape of surface
flaws, the accuracy or precision of manufacturing, and so forth.
Surface characterization
with a 3D optical profiler has been beneficially
used in determining and maintaining quality control in honing and grinding
of precision engineered surfaces, because of the non-contact nature
of the test. For example, in polishing, honing
or grinding processes, successive measurements can be made of the
exact same location, to determine the cumulative effect or effectiveness
of the finishing process. Researchers and scientists have discovered
the value of these recursive step height measurements in determining
the efficacy of machining, coating, etching and chemical planarizing
processes, as well as optimizing polish, cutting
or time and materials.
