Stylus profiler HRP 250

• Stylus profiler HRP 250

 

Surface profiler for advanced 45nm semiconductor technology at production throughputs

The HRP-250 is the industry’s most advanced high-resolution surface topography profiling system, offering chipmakers the ability to monitor significantly smaller lateral and vertical dimensions. Featuring diamond styli down to 20nm radius and a lower-noise platform for enhanced measurement sensitivity, the HRP-250 system offers nanometer-scale stylus technology which matches AFM resolution — without modeling requirements. The system’s high-resolution mode enables accurate control of nano-scale features for applications that directly impact device performance, such as Shallow Trench Isolation, CMP in the interconnect, metal film roughness and tungsten plug recess. For larger scale features, the system’s long-scan mode operates at high throughput to measure Cu CMP dishing and erosion, copper plating, die planarity, and C4 bump height in packaging. Higher scan speeds elevate the HRP-250’s production worthiness across a wide range of critical transistor and interconnect applications.

The system’s broad portfolio of styli, including the proprietary 20nm UltraSharp™ stylus, are based on diamond materials to offer the longest operating lifetimes, typically up to 100 times longer than AFM tips. New stylus developments further advance the technology not only by shrinking the stylus dimensions, but also enhancing the robustness to enable scanning up to five times faster than the previous HRP-240 system. Other system productivity enhancements contribute up to 40% higher system throughput while profiling critical structures in advanced 65nm and 45nm devices. In addition to the 200mm HRP-250 system, a 300mm HRP-350 is also available for IC semiconductor and disk drive manufacturing applications.