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WaferSight

Optical Wafer Dimensional Metrology System for Wafer Flatness, Shape, Thickness and Edge Roll-Off

• WaferSight

Product Highlights:

WaferSight is the new industry standard metrology tool for wafer OQC in volume manufacturing and IQC. The precision optical flatness gauge meets requirements for several generations of lithography technologies. High resolution data provides rapid feedback in polishing process development. New Edge Roll-Off metrics enable edge process development and monitoring in volume production.

• Qualify and monitor CMP (Chemical Mechanical Polishing)
• Useful in lithography qualification for several generations to come
• Industry standard optical metrology
• Measure edge rolloff for maximizing wafer yield and improving process
• Configurations available for:
• 300mm wafers
• 200mm advanced DSP wafer

• Precise, repeatable measurements
• Measurement features:
  • Full surface mapping - no stitching
  • Precise, repeatable measurements
  • Full edge grip handling
  • User editable recipes and jobs
  • High throughput
• Software features:
  • Measure flatness / shape to the edge of the wafer
  • Flatten die sites locally, to extrapolate yield
  • Multi-recipe job processing during production
  • Windows 2000 GUI
  • Edge roll-off analysis available
• Low cost of ownership
• Used by wafer manufacturers and incoming quality control for IC manufacturing

Flatness, thickness metrology with WaferSight

WaferSight system ensures wafers meet flatness, shape and thickness specifications as starting materials in semiconductor IC manufacturing by reporting polished wafer dimensional characteristics. WaferSight makes whole surface topology measurements using our proprietary interferometric shape-measuring technology. WaferSight is a production-ready, high-precision surface mapping system for 300mm and advanced DSP 200mm wafers, using proprietary optical interferometry.

• Above: superimposing a die pattern on a site flattened map shows how yield can be affected by epi pins and dimples.

Measuring surface height of both sides of a wafer directly, WaferSight provides the height sensitivity necessary to address process development needs for the leading edge semiconductor devices, as driven by Chemical Mechanical Polishing (CMP) and lithography imaging designs, up to the NTRS 45nm node — lowering your cost of ownership.

Powerful analysis software allows rapid visualization and quantification of polishing process signatures, including site defects that ultimately limit yield during semiconductor device fabrication. Software tools facilitate faster process development and precision process control during production, with reduced scrap costs. See statistical or 3d modeling of wafer thickness, flatness and shape maps, with wafer and/or site based parameters.